Senior/ Staff Package Design Engineer
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תקציר
Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI.
דרישות
- 5+ years of hands-on IC package design experience for high-performance semiconductor products, with full technical ownership from concept through tape-out
- Expert proficiency in IC package design tools (Cadence APD / SiP or equivalent) and hands-on experience designing complex packages (BGA, FCBGA, FCCSP)
- Strong package integration expertise, including stack-ups, ball/bump maps, constraints, SMT integration, and package BOM ownership
- Deep understanding of signal, power, and thermal integrity at the package level, with the ability to execute design tradeoffs based on analysis
- Proven manufacturing and release experience, including running DRC/LVS/DFM, OSAT engagement, and delivering production-ready package designs
- Experience with AI, networking, PCIe, CXL, or other high-speed data center interfaces (advantage)
- Familiarity with package reliability standards and qualificatio (advantage)