IC Package Layout Engineer
כדי להגיש, לשמור או לפתוח את דף המשרה מתחברים עם Google. זה חינם, ואחרי ההתחברות חוזרים ישר למשרה הזו.
תקציר
Mobileye develops purpose-built hardware and AI technologies that power advanced driver-assistance and autonomous-driving solutions. Our EyeQ™ SoCs and imaging radar technologies are designed to deliver scalable, automotive-grade performance and help enable safer mobility worldwide.
דרישות
- Experience with RF, SiP, multi-die, interposer, or 2.5D package layouts. (advantage)
- Experience with DDR, PCIe, SerDes, MIPI, or UFS interfaces. (advantage)
- Experience with Siemens Xpedition Package Designer or CAM350 . (advantage)
- Experience working directly with substrate manufacturers and OSATs. (advantage)
- Experience with scripting for package-layout automation. (advantage)